Structuring infrastructure
Photolithography
- Priming Hotplate Sawatec HP-200-HDMS
- Spincoater Sawatec SM-180-BM
- Spincoater Sawatec SM-200-BM
- Spray-Coater Sawatec i-Spray-300
- Hotplates Sawatec HP-150
- Hotplate Sawatec HP-310/350
- Circulating air ovens Haraeus UT6/UT6P
- Maskaligner EVG 620
- Maskaligner Süss MA/BA-8 inkl. NIL-Aufsatz SMILE
- Spray-Developer Sawatec SMD-250-BM
- Various bathes for immersion development (including circulation, heating and filtration)
- Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
Wet chemical cleaning and etching
- Coarse cleaning:
- Ultrasonic bath, heated
- Piranha cleaning
- Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
- Precision cleaning:
- Various bathes for cleaning (including circulation, heating and filtration)
- Piranha cleaning (H2SO4:H2O2)
- SC-1 (NH4OH:H2O2)
- SC-2 (HCl-H2O2)
- HF
- Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
- Various bathes for cleaning (including circulation, heating and filtration)
- Solvent cleaning:
- Various bathes for solvent cleaning (including circulation, heating and filtration and ultrasonic agitation incl. frequency mixing)
- Various bathes for aceton and IPA (incl. heating, US and goods movement)
- Various bathes for resist stripping (incl. heating, US and goods movement)
- Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
- Various bathes for solvent cleaning (including circulation, heating and filtration and ultrasonic agitation incl. frequency mixing)
- Glass, ceramic, oxide and nitride structuring:
- Various baths for the etching of glass, oxide and nitride (incl. circulation, heating and filtration)
- Glass etching bath (various HF etching solutions)
- BHF bath (buffered HF solution for SiO2 structuring)
- SiN etching bath (H3PO4 etching solution)
- Bathes for quick dump rinse, overflow rinse, N2-bubbling incl. conductance measurement
- Various baths for the etching of glass, oxide and nitride (incl. circulation, heating and filtration)
- Silicon structuring:
- Various etching bath for structuring crystalline or anisotropic silicon (incl. circulation, heating and filtration)
- KOH etching bath (anisotropic etching of crystalline silicon)
- TMAH etching bath (anisotropic etching of crystalline silicon, CMOS compatible)
- Poly-etch (structuring of polysilicon or amorphous silicon)
- Various etching bath for structuring crystalline or anisotropic silicon (incl. circulation, heating and filtration)
- Metal structuring:
- Various bathes for metal thin-film etching (partially incl. circulation, heating and filtration)
- Substrate rinsing and drying:
- Centrifugal dryer Sawatec TSM-180-BM
- Spin-Rinse-Dryer SRD PSC-102
- Hot water washer/dryer
- Circulation air ovens Haraeus UT6
Dry etching
- Silicon etching tool DRIE STS Pegasus
- Oxide etching tool STS AOE
- Reactive ion etcher ECR Plasmatherm SRL-770
- Plasma cleaner Barrel-Asher Branson/IPC Reactor Center PM-11030
- PVA Tepla plasma system GIGABatch 380M
- Plasma cleaner UCP
Further structuring technologies
Further technologies for microstructure fabrication are available in cooperation with other groups and competence areas:
- Selective laser etching (SLE)
- Micro casting (PDMS)
- Micro injectionmolding Babyplast
Contact
Marco CucinelliIMP Institut für Mikrotechnik und PhotonikLeiter Reinraum
+41 58 257 34 57marco.cucinelli@ost.ch