Layer thickness determination

Facilities for non-destructive and destructive coating thickness determinations are available:

Non-destructive layer thickness measurement

of Cu layers on printed circuit boards
of plastics and anodised layers on non-magnetic base material
of electroplated layers and lacquer layers on ferrous materials

Measurement methods

magnetic inductive (DIN EN ISO 2178)
magnetic (DIN EN ISO 2178) with eddy current (DIN EN ISO 2360)
electrical resistance (4 peaks)
X-ray fluorescence (in individual cases)

Destructive layer thickness measurement

After suitable preparation of the sample, it is viewed under the light or scanning electron microscope. In both cases, PC-supported image analysis is used for evaluation.

Dr.-Ing. Kerstin Kern

IMP Institut für Mikrotechnik und Photonik Projektleiterin und Fachverantwortliche Werkstoffprüfung

+41 58 257 34 08 kerstin.kern@ost.ch